At the beginning of the new year, the fully automatic laser picosecond drilling equipment independently developed and produced by China Electronics Technology Fenghua Information Equipment Co., Ltd. received orders and acceptance from many customers.
Fully automatic picosecond laser drilling equipment is one of the key equipment in the HTCC/LTCC process. It is used to punch micro-holes with a diameter of 30μm-200μm on the green ceramic sheet, and the number of punched holes is as high as 5000-100000 holes/ Zhang, and depending on the thickness of the product material, the laser processing efficiency can reach 300-4000 holes/s. This equipment has high drilling quality, small thermal impact, and micro-hole roundness up to 95%. It is suitable for micro-hole drilling, cavity cutting, laser coding, metal wire etching and other processing techniques.
After two years of unremitting efforts, the company's R&D team has successfully overcome the laser micromachining software system, laser microhole drilling optical system, picosecond/femtosecond laser microhole drilling process, fully automatic cleaning products and uninterrupted loading and unloading system, etc. The key technology is to realize the process of micro-hole drilling, cutting and opening, coding and marking, metal wire etching and other processes at the same time on this equipment, so as to realize the multi-purpose of one machine and improve the efficiency of production and processing. The stable operation of the equipment at the customer site has also gained a good reputation. At the same time, the series of double-head laser drilling equipment and femtosecond laser drilling equipment developed by the company have also been recognized by customers for their excellent performance, adding another weight to the company's laser microelectronic equipment layout.
